Scientist/Senior Scientist (PECVD Module for Advance Packaging) (APM), IME
5900 - 11800 SGDA*STAR
Job Responsibilities:
- Develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) process for advanced packaging applications.
- Characterize thin film properties and troubleshoot process-related issues to ensure quality and performance.
- Serve as a subject matter expert, supporting integration teams with technical insights and recommendations.
- Collaborate with fab teams to implement and maintain statistical process control (SPC) for thin film modules.
- Prepare and deliver technical reports and presentations for both internal stakeholders and external customers.
Job Requirements:
- PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, and Microelectronics, or related fields.
- 3-5 years direct experience in semiconductor thin film module, preferably in PECVD module.
- Good understanding of thin film deposition techniques and thin film property characterization is desired.
- Hands-on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem-solving methods is desired.
- Understanding of thin film tool hardware is advantageous.
- Hands-on experience with basic process characterization techniques such as DRSEM, CDSEM, HRTEM and Ellipsometry is advantageous.
- Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.
4750 - 9500 SGD
...Job Description Institute of Microelectronics (IME) is leading an R&D program dedicated to advancing critical process modules for next-generation device fabrication. The program emphasizes innovation in key areas such as ion implantation — an essential building block for...3000 - 6000 SGD
...Job Responsibilities: Responsible for developing and optimizing PECVD processes to support IME’s various program requirements. Responsibilities include diagnosing malfunctions and using test equipment or software to test faulty hardware parts, applying knowledge of the...4750 - 9500 SGD
...Job Description We are seeking a talented and self-motivated Scientist, the successful candidate will join the Advanced Process Modules (APM)team at IME, develop specialty technologies for CMP process. Key Roles and Responsibilities # Develop CMP process for silicon...4750 - 9500 SGD
...Job Description Research scientists working on the wafer-to-wafer... ...optimizing, and integrating advanced hybrid bonding techniques for... ...applications like 2.5D and 3D IC packaging. Job Responsibilities:... ...mapping: Collaborating with senior staff and process integrators...3000 - 6000 SGD
...Job Responsibilities: Developing and optimizing Physical Vapor Deposition (PVD) module processes for advanced packaging applications. Thin film property characterization and process issue troubleshooting. Develop high performance film and yield improvement strategies...5900 - 11800 SGD
Job Responsibilities: Leading central lithography team under pattern transfer group. Selection, procurement and qualification of litho tool sets based on program -- from contact aligner to immersion. Actively working with cross functional stake owners to plan and develop...4750 - 9500 SGD
...leading research institute dedicated to advanced Wide‑Band Gap Semiconductor Technologies... ...Sensors, Flat Optics, MEMS and Advanced Packaging . Our mission is to push the boundaries... ...will join a multidisciplinary team of scientists and engineers working at the intersection...5900 - 11800 SGD
...Developing and optimizing Atomic Layer Deposition (ALD) process for Advanced Packaging, Wide-Band-Gap Devices (WBG) and Photonics applications.... ...team in establishing statistical process control for thin film module. Generate and present reports to both internal and external...3000 - 6000 SGD
...and optimize CMP process for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications. Collaborate... ...and sustaining statistical process control (SPC) for CMP modules, ensuring consistent process performance. Prepare and deliver...2200 - 4400 SGD
...Job Descriptions: Support the development of thin film deposition (ALD, PVD and PECVD) and film property measurement and inspection to support the fabrication of innovative semiconductor devices. Collaboration with process integration team to establish manufacturable...4750 - 9500 SGD
...Job responsibilities: Develop and innovate critical flat optics modules. Drive multi-functional teams to optimize existing process flows and develop new innovative integration solutions to meet potential product requirements and manufacturability. Develop or redefine...3000 - 6000 SGD
...process specifications. Generate comprehensive technical reports for both internal teams and customers. Collaborate closely with senior engineers, process integrators, and cross-functional teams to align with technology roadmaps and process capability requirements....4500 - 9000 SGD
...A*STAR Institute of Microelectronics (A*STAR IME) is leading an R&D initiative focused on advancing critical process modules for next-generation semiconductor device fabrication... ...The process engineer will work closely with a Senior Scientist and cross-functional technology teams...5500 - 11000 SGD
...nationalities, our people and our advanced semiconductor devices are playing... ...potential. Job's mission As a Senior / Process Engineer in Advanced Packaging, you will bring your research... ...closely with experienced engineers and scientists, you will translate scientific...3000 - 6000 SGD
...motivated Research & Technical Support Engineer/Scientist to develop, maintain, and support BEOL... ...collaborate with R&D teams working on advanced interconnect technologies , photonic... ...teams in Photonic IC, Wide-Bandgap Devices, Packaging and reliability for process integration....7900 - 15800 SGD
...development, and evaluation in support of the IME's variety of programs requirements such as... ...new requirements. Work closely with senior members and process integrators to... ...levels. Lead Wet clean / etch, CMP and ECP module teams. Requirements: Doctor's degree...3000 - 6000 SGD
...Job Description We're seeking a talented and passionate Process Engineer/Senior Process Engineer to join our epitaxy team, Advanced Process Modules (APM). The successful candidate will be responsible for SiC epitaxy process development for next-generation power devices...4750 - 9500 SGD
...external customers. Collaborate closely with design, process module and fab engineering teams to resolve technical challenges and define... ...independently and collaborate effectively within a team. For senior-level roles, a minimum of 3 years of experience in semiconductor...4750 - 9500 SGD
...Job Description We are seeking a talented and passionate Scientist/Senior Scientist to join our silicon carbide (SiC) crystal growth team. The successful candidate will play a crucial role in developing crystal growth technologies for semi-insulating SiC wafer production...1900 - 3800 SGD
...Responsibilities: Support the development of thin film deposition, etching, wet cleaning, wafer bonding and release process modules to enable the fabrication of innovative MEMS devices. Collaboration with process integration team to establish manufacturable fabrication...3000 - 6000 SGD
...Description As a Research Engineer in the Wafer-to-Wafer (W2W) Bonding Module, you will work on Temporary Bonding and Debonding (TBDB) processes—an essential step in advanced semiconductor packaging for handling ultra-thin wafers. This role focuses on process development,...9000 - 12000 SGD
...Collaborate and drive cross functional integration across design process, packaging, test, reliability and production teams Analyse parametric... ...technologies, manufacturing environment Experience in sensor module packaging and/or optical engineering will be an advantage....7000 SGD
...Position title : Senior Advanced Packaging Process Engineering [ TCB / HBM / CoWoS / 2.5D / 3D packaging ] Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : SGD 7,000 – SGD 10,000/month (Based on experience) Responsibilities...5500 - 7500 SGD
...Role Overview We are looking for a Data Scientist / Senior Data Scientist to develop machine learning, advanced analytics and AI-driven solutions for large-scale public-sector projects. This role covers the full analytics lifecycle, including requirement gathering, data...- ...to produce virtually every new chip and advanced display in the world. We design, build and... ...We are seeking a highly skilled Advanced Packaging Integration Engineer to join the... ...Chemical Vapor Deposition (CVD) (Including PECVD for low-temperature applications), Atomic...
1900 - 3800 SGD
Job Description We are looking for an Assistant Engineer to support the Flat Optics and Photonics Integration development. This is an exciting opportunity for an early-career engineer to gain hands-on experience in semiconductor processing and work on cutting-edge flat...3800 - 6500 SGD
...Mechanical, Microelectronics, Materials, Optics or Chemical Engineering Preferred 3 - 5 years in either R&D, packaging technologies, manufacturing. Fresh graduates will be considered. Experience in sensor module packaging and/or optical engineering will be an advantage....5500 - 11000 SGD
...Center-of-Excellence team that works on challenging problems in advanced AI (including areas on generative multimodal AI, autonomous... ...guidance to a small and highly skilled team of junior and senior data scientists embedded in Kanban data squads. These squads deliver...4750 - 9500 SGD
...Job Summary The AMS Division, IHPC, A*STAR, is seeking a highly motivated Research Scientist to join a dynamic, multi-disciplinary team. This position is part of a joint laboratory initiative with an Oil&Gas company, focusing on the degradation behavior and reliability...8000 - 15000 SGD
...This role leads end-to-end integration of advanced semiconductor packaging platforms, with emphasis on 2.5D, 3D, and heterogeneous system integration. You will own the post-fabrication value chain—from wafer-level processes through assembly, qualification, and reliability—supporting...
Do you want to receive more vacancies?
Subscribe and receive similar vacancies to Scientist/Senior Scientist (PECVD Module for Advance Packaging) (APM), IME. Be the first to apply!
