Senior/Principal Digital Logic Circuits Engineer for NAND Flash

Key Responsibilities:

• Responsible for the architecture design, RTL encoding (Verilog / System Verilog), and functional verification of digital control logic in 3D-NAND memory
• Design a state machine (FSM) to manage complex NAND operation processes (such as Program, Read, Erase, Copy-back, Suspend/Resume, etc.)
• Develop a command decoder and address/parameter parsing logic to ensure compliance with JEDEC and internal specifications
• Implement high-precision timing control logic to accurately generate the internal timing signals required for various operations (such as tR, tPROG, tBERS, etc.)
• Deeply involved in the physical layer and link layer logic implementation of ONFI (Open NAND Flash Interface) or Toggle Mode interface protocols , supporting DDR, NV-DDR, NV-LPDDR, and other modes
• Collaborate with the analog / mixed-signal team to define array access timing, voltage switching windows, and read/write path control interfaces
• Collaborate with firmware (FW) and system architecture teams to develop register maps, interrupt mechanisms, error handling strategies, and debug interfaces
• Support UVM verification environment setup, provide Design for Testability (DFT) support, and participate in FPGA prototyping
• Participate in chip bring-up, post-silicon debugging, and performance optimization to ensure products meet specification requirements.

Required Qualifications:

1. Education: Master's degree or above
2. Major: Microelectronics and Integrated Circuits, Electrical Engineering, Computer Engineering, or related fields
3. Other Requirements:

• Minimum 5 years digital IC design experience, experience in NAND Flash or SSD controller projects is a plus
• In-depth understanding of ONFI 4.x or Toggle 2.0/3.0 protocol specifications, with practical interface IP development or integration experience
• Experience in control logic design under 3D-NAND or TLC/QLC architectures is a plus
• Familiar with ECC control interfaces (such as LDPC/BCH engine scheduling and interaction)
• Excellent cross-functional collaboration skills, able to communicate efficiently with simulation, firmware, verification, testing, and product teams to jointly develop technical solutions.
• Experience with successfully tape-out and mass-produced memory chip projects is a plus.