Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND

As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below. This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND. You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to:

Leading innovation in Dry Etch technology and essential module advancement

• Develop and innovate dry etch processes to meet structural and electrical specifications.

• Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products.

• Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect outcomes.

• Collaborate and lead cross-functional teams to solve complex structural problems.

• Present process and technology roadmaps for current and future technology nodes.

• Proactively predict when and how a future issue could arise and build mitigation plans.

• Contribute towards the Technical Leadership Program.

• Mentor less experienced engineers and encourage skills within the team.

• Be associated with critical modules such as HAR, Tier by tier etches, WL contacts & staircase.

Collaboration with other Process Areas

• Find opportunities and drive towards a collaborative solution.

• Guide other areas on technology roadmaps.

• Lead or be part of cross-functional task force groups driving towards a target.

• Drive towards general expertise in other areas' process hardware or technologies.

Interaction with Dry Etch peers

• Serve as a resource and mentor for colleagues in dry etch technology and/or project management.

• Provide critical updates to upper management on project status and impacts.

Successful candidates for this position will have:

• Demonstrated interest in research and development environment.

• 6-10 years’ experience in dry etch process development in R&D moving into manufacturing.

• 4-5 years of applicable NAND, DRAM, or Logic module development experience, for example: projects and deliveries involving cross-functional teams.

• Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework.

• Demonstrated leadership in problem-solving. Experience in managing technical projects.

• Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries).

• Expertise in statistical process control and analysis.

• Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes.

• Lead supplier head-to-heads.

• Data science basics/Python coding/AI coders shall be preferred over candidates without this experience.

• Strong computer skills, including MS Office, and SAS software like JmP oe similar.

Education

• Masters/PhD or equivalent experience in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering, or related fields, along with at least 6 years of pertinent dry etch process development experience.

• Bachelors/Masters (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering or related fields) with at least 10 years of pertinent dry etch process development experience.