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Senior/ Packaging Designer

5000 - 9000 SGD
Full-time

SILICON BOX PTE. LTD.

Position Summary

The Senior/ Package Designer is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

  • With reference to internal design guidelines, work with the internal & external customer to:
  • Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
  • Generate test vehicle design and the related PCB design.
  • Prepare design risk assessment report.
  • Generate reticle and stencil design.
  • Generate other schematics or drawing as requested.
  • Review, maintenance and update the design guidelines.
  • Manage the conversion of internal design into suppliers’ final design.
  • Document all the drawing revisions and change records.
  • Support audits
  • Any other ad-hoc duties as assigned

Requirements

  • Minimum Bachelor's Degree or Master’s Degree in electrical engineering or similar discipline
  • Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability
  • Experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes will bean advantage
  • Hands-on skills on design software tools like Linkcad, Cadence, CAM350, AutoCAD, GDS, Gerber editors
  • Experience with PCB test board design
  • Fresh graduates are welcome to apply
Vacancy posted 19 hours ago
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