Laboratory Operations Engineer (1-Year Contract)

Samsung Electronics Device Solution is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world.

About the Role :

Laboratory Operations Engineer plays a critical role in ensuring the seamless operation of the Device Solution Research Singapore (DSRS) center. This position is responsible for the comprehensive management of advanced semiconductor and optical packaging laboratory infrastructure, including high-precision equipment maintenance, material inventory control, and strict adherence to safety and compliance standards. The ideal candidate will act as a technical bridge, supporting R&D engineers by maintaining an optimal testing environment and providing valuable technical feedback during the prototype characterization process.

Responsibilities :

Laboratory Equipment Management

• Support the operation of assembly, metrology, and optical test equipment within the lab.
• Perform regular tool operational checks and preventative maintenance to ensure optimal tool condition and minimal downtime.

Material & Sample Inventory Management

• Manage tracking and timely procurement of common lab consumables and equipment-attached consumables.
• Oversee the tracking and organization of prototype samples.
• Facilitate and assist in procurement processes with external vendors.

Facility Infrastructure & Compliance

• Maintain a safe, compliant, and well-functioning laboratory environment.
• Take full responsibility for all laboratory-related safety protocols and regulatory compliance matters.
• Compile raw data and provide lab-level test reports to SG Research engineers, offering active technical feedback observed during testing.

Qualifications :

• Bachelor degree in a science or engineering major like material engineering, electric/electronic engineering, mechanical engineering, chemistry or physics.
• Minimum 2 years of experience of clean room lab management.
• Hands-on experience with optical assembly equipment like optical tester, active optical 6-axis aligner, passive pick & place, wire bonder, die bonder, flip-chip bonder, epoxy dispenser, and UV curing tools will be a plus.
• Good understanding of optical packaging and optical alignment technologies as well as heterogeneous packaging of photonics IC and electronic IC with advanced packaging technologies is preferred.
• Knowledge and experience in CPO and optics processes, integration and characterization.
• Knowledge on packaging materials such as UV epoxies, conductive epoxies, solders, 3D printing materials, polymer, glass, ceramic and magnetic materials.
• Knowledge on active and passive alignment of micro-lens array or Fiber array is a plus.
• Team player with good verbal and written communication skills.

'We will not request or collect any confidential information, including trade secrets of your current or former employers at all times. All applicants are reminded not to share the same with us during your application process.'