Advanced Packaging & Process Integration Engineer - Leading R&D Organization
4300 - 7800 SGDFull-time
Wanco Manpower Pte Ltd
Our client is a well-established research and technology organisation , focusing on advanced R&D and the development of next-generation semiconductor technologies.
We are looking for an Advanced Packaging & Process Integration Engineer to support the research and development of advanced semiconductor packaging and heterogeneous integration technologies.
Position: Advanced Packaging & Process Integration Engineer
Employment Type: Full Time, Permanent
Location: Singapore
Responsibilities:
- Research and develop fine-pitch flip-chip and hybrid bonding technologies
- Develop Chip-to-Wafer and Wafer-to-Wafer bonding processes
- Support interposer and hybrid bond pad fabrication and process integration
- Optimise bonding materials, surface preparation and process parameters
- Conduct engineering experiments, process optimisation and data analysis
- Improve process yield, performance and reliability
- Support 2.5D / 3D heterogeneous integration technology development
- Collaborate with internal teams and external partners on R&D projects
Requirements:
- Bachelor’s Degree in Materials, Mechanical, Chemical, Electronics, Electrical, Computer Engineering or related discipline
- 1–6 years of relevant experience in microelectronics, semiconductor or component integration
- Experience in advanced packaging / process integration is preferred
- Hands-on experience in flip-chip bonding will be advantageous
- Knowledge of hybrid bonding equipment and materials is advantageous
- Experience in process development, data analysis and DOE preferred
- Good analytical, problem-solving and communication skills
**Interested candidates, kindly email updated resume to View email address on mycareersfuture.gov.sg with Subject of "Advanced Packaging & Process Integration Engineer", thank you.
Vacancy posted 6 hours ago
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