Engineer - Wafer Bumping Equipment (PVD/ Descum/ Wet)
JTCCS Careers
Engineer – Wafer Bumping Equipment (PVD/ Descum/ Wet)
Responsibilities:
· Lead Equipment support team for in depth technical analysis
· Carry out effective planning for CM and PM (inclusive of system setup)
· Maintain high equipment reliability with minimal resource requirement
· Equipment startup, installation and maintenance
· Troubleshooting and provide upgrade or improvement to the equipment
· Analyze equipment failure mode and carry out continuous improvement plan
· Liaising and negotiating with external party on parts enquiry and quotation
· Provide training and guidance to subordinates
· Participate OEE and capacity improvement projects
· Generating OPL and operational procedure and document in support of QMS documentation
· Parts tracking and ordering base on system
· Vendor negotiation on support and parts inventory
· ESD system setup and monitoring for all system
· Risk assessment for existing and new system
· Smart factory support and maintenance (AMR, CDS system maintenance)
Requirements:
· Degree in Engineering preferably Mechanical, Electrical, Electronics
· 3 years of relevant experience preferably in semiconductor industry
· Good problem-solving skills and communication skills
Vacancy posted 21 days ago
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