Corporate R&D Process Development Engineer (Dam & Fill Encapsulation and Laser Marking)

We are seeking a highly motivated R&D Process Development Engineer to join our Advanced Packaging R&D team. This role will focus on the development, optimization, and troubleshooting of Dam & Fill encapsulation and Laser Marking processes for semiconductor packaging applications.

Key Responsibilities

• Develop, evaluate, and optimize Dam & Fill encapsulation processes for new semiconductor packages.
• Develop and optimize Laser Marking processes and establish robust manufacturing process recipes.
• Perform DOE (Design of Experiments), characterization studies, and statistical analysis using JMP software.
• Analyze evaluation data and generate technical reports with clear recommendations and conclusions.
• Troubleshoot process-related issues using structured problem-solving and quality improvement methodologies.
• Collaborate with Operations, Quality, Purchasing, equipment vendors, and material suppliers to resolve technical challenges.
• Support customer builds, engineering evaluations, and urgent development activities when required.
• Drive cost improvement initiatives through material evaluation, process optimization, and BOM management.
• Participate in technical discussions, project reviews, and customer meetings to provide engineering expertise.
• Contribute to innovation activities, including intellectual property and patent development opportunities.

Requirements

• Bachelor's degree in engineering, preferably Mechanical, Electrical, Electronics, Materials, Manufacturing, or related disciplines.
• Minimum 3 years of experience in semiconductor assembly or advanced packaging environment:
• Experience in Dam & Fill encapsulation processes and Laser Marking processes
• Experience in Image Sensor Assembly will be an added advantage.
• Hands-on experience with Asymtek Dispensing Systems and EO Technics Laser Marking Equipment will be an added advantage.
• Strong knowledge of:
• Design of Experiments (DOE)
• Statistical analysis using JMP software
• DFMEA / PFMEA methodologies
• Root Cause Analysis and problem-solving tools
• Quality improvement methodologies
• Ability to interpret engineering and mechanical drawings.
• Technical report writing and documentation skills.
• Strong analytical and troubleshooting capabilities.
• Good presentation and communication skills.
• Effective cross-functional collaboration and stakeholder management.
• Self-motivated with strong initiative and learning agility.
• Positive attitude and ability to work effectively in a team environment.