ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)
5500 - 7500 SGDMicron Semiconductor Asia Pte Ltd
Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community.
We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing.
The position partners closely with stakeholders such as Development Team & Manufacturing and supplier teams across Micron’s global network.
Main Responsibilities
Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness.
Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work.
Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualifications.
Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
Perform risk assessments Failure Mode & Effect Analysis (FMEA) and implement effective control plans and corrective actions for abnormal conditions.
Enable smooth technology transfer from development to high‑volume manufacturing.
AI Responsibilities:
Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
Minimum Required Qualifications
Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline.
Operations support, including shift and weekend coverage, is required.
Strong analytical, logical, and critical thinking skills
Effective communicator, able to collaborate across all levels
Growth mindset with a passion for continuous learning
Internship or experience in the semiconductor industry is a plus
Demonstrated leadership and a track record of impact are highly desirable
Interest in and knowledge of the semiconductor industry and Micron is preferred
Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.
Embody Micron’s core values:
People – Respect, develop, and empower others
Innovation – Drive continuous improvement and breakthrough thinking
Tenacity – Show grit and determination
Collaboration – Build trust and foster teamwork
Customer Focus – Deliver excellence and value
Must‑Have Soft Skills
Use AI -enabled tool responsibly and optimally for research, analysis, content creation, problem-solving, operational task, and achieving business outcome.
Highly Desirable / Preferred Skills
Familiarity with MES systems, automation, and data analytics tools (e.g., JMP, Python).
Inclusion & Accessibility Statement
Micron is committed to fair, inclusive, and merit‑based hiring. Reasonable accommodation is available to enable individuals with disabilities to perform the essential functions of this role. All qualified candidates are encouraged to apply.
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